Method and apparatus for a thermally conductive packaging...

Details Method and apparatus for a thermally conductive packaging... Method and apparatus for a thermally conductive packaging...

2008-06-10

2008-06-10

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S705000, C361S708000, C361S715000

Reexamination Certificate

active

07385812

ABSTRACT:
A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.

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