Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-11-18
2000-05-09
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361698, 361699, 361700, 361704, 361719, 361818, 257718, 257719, 174 152, 174 35R, 165 803, 165 804, H05K 720
Patent
active
060612355
ABSTRACT:
A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal. Further, by including the processor and a heat sink in the field replaceable apparatus, the field replaceable apparatus reduces handling in the field and the risk of damage to the processor, and may be tested prior to installation in the field to ensure it operates properly.
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F.J. DeMaine, et al., "Attachable Heat Sink For Pluggable Modules", IBM Technical Disclosure Bulletin, vol. 22--No. 3, Aug. 1979, pp. 960-961.
Cromwell S. Daniel
Nobi Laszlo
Chervinsky Boris L.
Hewlett--Packard Company
Picard Leo P.
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