Method and apparatus for a layered thermal management...

Details Method and apparatus for a layered thermal management... Method and apparatus for a layered thermal management...

2005-03-09

2008-08-19

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S714000, C174S015100, C165S080400, C165S104330

Reexamination Certificate

active

07414843

ABSTRACT:
Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.

REFERENCES:
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patent: 5099910 (1992-03-01), Walpole et al.
patent: 5727618 (1998-03-01), Mundinger et al.
patent: 6301109 (2001-10-01), Chu et al.
patent: 6457515 (2002-10-01), Vafai et al.
patent: 2001/0020365 (2001-09-01), Kubo et al.
patent: 2003/0213580 (2003-11-01), Philpott et al.

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