Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-10-12
1998-10-06
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361764, 361783, 257684, 257723, 257782, 257786, 174260, 438107, H01L 2700
Patent
active
058186980
ABSTRACT:
A semiconductor apparatus and method of manufacture therefor comprises a printed circuit board (PCB) having a plurality of pads with each pad adapted to receive a bond wire and a plurality of holes through the PCB. The apparatus further comprises a semiconductor die associated with each hole, each semiconductor die having a circuit side with bond pads on the circuit side, wherein the circuit side of each said die is attached to the printed circuit board. The apparatus also comprises a plurality of bond wires each having first and second ends, wherein the first end is attached to one of the bond pads and the second end is attached to one of the PCB pads and each bond wire passes through one of the plurality of holes.
REFERENCES:
patent: 4598308 (1986-07-01), James et al.
patent: 5107328 (1992-04-01), Kinsman
patent: 5240588 (1993-08-01), Uchida
patent: 5243497 (1993-09-01), Chiu
patent: 5313096 (1994-05-01), Eide
patent: 5384689 (1995-01-01), Shen
patent: 5502289 (1996-03-01), Takiar et al.
Micro)n Technology, Inc.
Picard Leo P.
Vigushin John B.
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