Method and apparatus for a backsided and recessed optical...

Details Method and apparatus for a backsided and recessed optical... Method and apparatus for a backsided and recessed optical...

2006-05-09

2006-05-09

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S675000, C257S678000, C257S703000, C257S704000

Reexamination Certificate

active

07042082

ABSTRACT:
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

REFERENCES:
patent: 4839716 (1989-06-01), Butt
patent: 5311007 (1994-05-01), Kato
patent: 6207950 (2001-03-01), Verdiell
patent: 6647039 (2003-11-01), Fu et al.
patent: 6739764 (2004-05-01), Ido et al.
patent: 6821032 (2004-11-01), Lake et al.

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