Method and apparatus for a backsided and recessed optical...

Details Method and apparatus for a backsided and recessed optical... Method and apparatus for a backsided and recessed optical...

2005-03-08

2005-03-08

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S693000, C257S704000, C257S432000, C257S434000, C257S435000

Reexamination Certificate

active

06864553

ABSTRACT:
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

REFERENCES:
patent: 4839716 (1989-06-01), Butt
patent: 5311007 (1994-05-01), Kato

Affiliated with

Also associated with

Rating

Method and apparatus for a backsided and recessed optical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for a backsided and recessed optical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for a backsided and recessed optical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3381269