Method and an external plating arrangement for sealing off the c

Details Method and an external plating arrangement for sealing off the c Method and an external plating arrangement for sealing off the c

1979-04-10

1981-04-14

Faw, Jr., Price C.

Static structures (e.g., buildings)

Opaque stonelike module

Lateral retaining feature on facing sheet

110340, 52741, E04B 504

Patent

active

042611547

ABSTRACT:
An external plating arrangement for improved effectiveness in sealing off the cold end face of a refractory body, wherein the side walls of the body are sheathed with metal plates and planar portions extend normally from the plates and overlie the cold end face for encasing the perimeter of the cold end face. A separate metal plate may cover the cold end face, the planar portions having a form of elongated tabs for overlying the end plate. Alternatively, the planar portions may be right triangular for completely covering the cold end face, or one of the planar portions may be rectangular for covering the cold end face, the other planar portions being elongated tabs overlying the rectangular plate.

REFERENCES:
patent: 2125192 (1938-07-01), Morlock
patent: 2125193 (1938-07-01), Morlock
patent: 2180969 (1939-11-01), Seil
patent: 2216813 (1940-10-01), Goldschmidt
patent: 2465170 (1949-03-01), Rochow
patent: 2764887 (1956-10-01), D'Ambly
patent: 2791116 (1957-05-01), Hewes et al.
patent: 2901990 (1959-09-01), Hutter
patent: 3073067 (1963-01-01), Shonkwiler
patent: 3301546 (1967-01-01), Hansen et al.
patent: 3832478 (1974-08-01), Books

Affiliated with

Also associated with

Rating

Method and an external plating arrangement for sealing off the c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and an external plating arrangement for sealing off the c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and an external plating arrangement for sealing off the c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-152547