Method and an encapsulation for encapsulating electrical or elec

Details Method and an encapsulation for encapsulating electrical or elec Method and an encapsulation for encapsulating electrical or elec

1992-01-08

1994-12-27

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257787, H01L 2328

Patent

active

053768248

ABSTRACT:
A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.

REFERENCES:
patent: 3706840 (1972-12-01), Moyle et al.
patent: 4701999 (1987-10-01), Palmer
patent: 4933744 (1990-06-01), Segawa et al.
patent: 5065224 (1991-11-01), Fraser et al.

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