Method and an arrangement for mounting a component on a carrier

Details Method and an arrangement for mounting a component on a carrier Method and an arrangement for mounting a component on a carrier

1997-11-24

2000-01-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

060109203

ABSTRACT:
There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

REFERENCES:
patent: 2911609 (1959-11-01), Burtt et al.
patent: 3793720 (1974-02-01), Van Rijsewijk et al.
patent: 5295298 (1994-03-01), Sakamoto
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5557145 (1996-09-01), Kobayashi et al.

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