Method and an apparatus for the wet treatment of a semiconductor

Details Method and an apparatus for the wet treatment of a semiconductor Method and an apparatus for the wet treatment of a semiconductor

1997-10-15

2000-10-31

Utech, Benjamin L.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 2, 216 90, B08B 600, C03C 2300

Patent

active

061386901

ABSTRACT:
A method for the wet treatment of a semiconductor wafer comprised of subjecting a semiconductor wafer to chemicals treatment, rinsing with pure water and drying by direct transfer of the wafer to an atmosphere of a vapor containing an alcohol, wherein the semiconductor wafer is treated with a solution containing a semiconductive particle-removing agent during the interval between the steps of the chemicals treatment and the drying. The semiconductive particle-removing agent is one which is able to control the zeta potential of the particles to prevent the deposition of the particles. Alternatively, semiconductive colloid coagulants may be used which inhibit the formation of the particles by coagulation of semiconductive colloids. Thus, deposition of particles on a wet-treated semiconductor wafer is prevented.

REFERENCES:
patent: 5002618 (1991-03-01), Kanai et al.
patent: 5148823 (1992-09-01), Bran
patent: 5520744 (1996-05-01), Fujikawa et al.
patent: 5733434 (1998-03-01), Harada et al.

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