Method and an apparatus for simultaneous 2D and 3D optical...

Details Method and an apparatus for simultaneous 2D and 3D optical... Method and an apparatus for simultaneous 2D and 3D optical...

2005-11-09

2009-06-23

Toatley, Jr., Gregory J (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

C356S237200

Reexamination Certificate

active

07551272

ABSTRACT:
The present invention relates to optical inspection of manufactured products, such as integrated circuits wafer bumps. There are provided methods and apparatus for acquisition of optical inspection data of said object, as well as for optical inspection and manufacturing of said object. The invention comprises a 2D optical scanning system and a 3D optical scanning system that can have common image trigger control and/or operate simultaneously without interference to have the same field of view.

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