Hazardous or toxic waste destruction or containment – Destruction or containment of radioactive waste – Chemical conversion to a stable solid for disposal
Patent
1997-12-19
1999-12-07
Straub, Gary P.
Hazardous or toxic waste destruction or containment
Destruction or containment of radioactive waste
Chemical conversion to a stable solid for disposal
588 3, 588 4, 588 9, 588 10, 588 12, 588 14, 588 15, 588 20, G21F 900
Patent
active
059986905
ABSTRACT:
A unique method for solidification of solutions containing boric acid and/or borates is disclosed in this invention. The boron species in the solutions are polymerized to form polyborates, and the solutions are then solidified by mixing with solidification agents which are prepared completely from inorganic materials. Therefore, the solid form produced by this method has no aging problem. The boron species in the solution are not merely wastes to be encapsulated or embedded, they take part in the solidification reaction and share a major portion of total reactants. Thus, the total volume of solid forms produced in this invention is less than 1/10 of that produced in conventional cementation.
REFERENCES:
patent: 4210619 (1980-07-01), Haley
patent: 4293437 (1981-10-01), Taponier et al.
patent: 4620947 (1986-11-01), Carlson
patent: 4664895 (1987-05-01), McDaniel
patent: 4800042 (1989-01-01), Kurumada et al.
patent: 5096624 (1992-03-01), Dorr et al.
patent: 5457262 (1995-10-01), Huang et al.
patent: 5645518 (1997-07-01), Wagh et al.
Huang Ching-Tsven
Yang Wen-Yi
Institute of Nuclear Energy Research
Nguyen Cam N.
Straub Gary P.
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