Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Parameter related to the reproduction or fidelity of a...
Patent
1997-01-29
1998-12-01
Ballato, Josie
Electricity: measuring and testing
Impedance, admittance or other quantities representative of...
Parameter related to the reproduction or fidelity of a...
343703, G01R 2908, G01R 3128
Patent
active
058444149
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a method and a system for repeatedly, by means of a positioning device, moving a measuring means to a plurality of positions above a test object, e.g. an electrically or electronically equipped printed board, at which the electromagnetic compatibility, hereinafter referred to as EMC, and/or the temperature is measured at each of the plurality of positions, and thereafter said measuring values are stored in a memory together with the position (coordinates) of said measuring means. A test object could in the case of measuring the EMC be any object that causes or is affected by interference, and in the case of measuring the temperature the test object could be virtually any object, of which the temperature is of interest, such as electronic equipment, humans etc.
BACKGROUND OF THE INVENTION
The requirements on electronic equipment released onto the market are becoming greater and greater. One of the requirements which modules in electronic equipment must meet concerns emission and immunity (EMC), i.e. electronic equipment is not allowed to cause interference in other electronic equipment or be affected by interference from such equipment themselves. The limits for EMC are set by national and international standards and have, during recent years, gradually become severer. In order to get a product out on the market it must first go through an EMC test and be approved by the country's equivalent to SEMKO (Sweden's Electric Measuring and Testing Unit).
Since changes in designs and redesigns are expensive and extend the time it takes for the product to reach the market, it is in the designer's interest to ensure, at an early stage, that the product will pass such an EMC test if production costs are to be kept to a minimum.
One problem with the design of electronic equipment is that of locating and taking measures against sources of interference as early as possible in the design process in order to comply with the ever increasing requirements which are put on modules in electronic equipment.
Another problem in designing electronic equipment is that of locating where in the equipment the temperature is high. By acquiring such information the cooling of the relevant components can be optimised thus increasing the life of the product.
THE STATE OF ART
The means by which the designer today can measure EMC lack precision and/or are expensive. In order to measure EMC during the design of the product the designer manually scans the electrically or electronically equipped printed circuit (module) by hand with a measuring probe which via an amplifier is connected to a spectrum analyser. The designer is able to see the frequency content of the source of interference on the spectrum analyser display, i.e. the emission of the printed board assembly in the position where the measuring probe is located.
However, the immunity of the printed board assembly is not measured with this method. Another disadvantage with this method is the lack of precision in measuring the position of the source of interference. Since the measuring probe is scanned manually over the printed board assembly it is difficult to fix the exact position of the source of interference. Although it is true that the source of interference, i.e. the component which causes the interference, is located, the exact position is not known and it is therefore difficult to carry out a new comparative measurement, after that the original interference has been reduced. Thus, there is a need to be able to carry out repeated EMC measurements in order to continuously get a picture of the EMC of printed board assembly during the design process.
Another method of checking the EMC of the printed board is to wait until the product in which the printed board assembly is installed undergoes a EMC test by SEMKO or an equivalent national authority. If the product does not fulfil the requirements of this test then the product must be redesigned. The disadvantage with this procedure is that the designer only is given the i
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Modern Elektronik, vol., No. 19, Nov. 1982, Mats Viggh, "Signalmatningar -- metoder och instrument", p. 36 -p. 38, The last portion in col. 5 at p. 38.
Patent Abstracts of Japan, vol. 18, No. 125, P-1701, abstract of JP, A, 5-312867 (Tochigi Pref Gov), 26 Nov. 1993.
Eriksson Anders
Eriksson Jan
Ohman Per
Ballato Josie
Solis Jose M.
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