Method and a pick-up device for lifting and moving semiconductor

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214152, 302 2R, 294 64B, 214 1BS, B65G 6504

Patent

active

040022544

ABSTRACT:
A method and a Bernoulli pick-up device for lifting and moving flat disc-shaped work pieces such as semiconductor wafers. The pick-up device has a working member the under side of which forms a flat suspension surface incorporating the orifice of a single inclined jet through which air is ejected in an unbalanced flow towards a limiting surface at one end of the suspension surface. In operation the working member is positioned over a wafer with the jet orifice separated a predetermined distance in front of the center of gravitation of the wafer whereby an initial drawing movement towards the limiting surface is impressed on the wafer. Wafers can be unloaded from a wafer magazine without any need of centering the suspension surface relative to the wafer. An improved magazine design makes it possible to unload wafers from arbitrary tracks independent of the presence of wafers in neighbor tracks.

REFERENCES:
patent: 3516386 (1970-06-01), Landwehr et al.
patent: 3645581 (1972-02-01), Lasch, Jr. et al.
patent: 3822025 (1974-07-01), Loos
patent: 3902618 (1975-09-01), Levy et al.
IBM Technical Bulletin vol. 16 No. 2; July 1973.

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