Method an apparatus for obtaining reflow oven settings for solde

Details Method an apparatus for obtaining reflow oven settings for solde Method an apparatus for obtaining reflow oven settings for solde

1994-11-09

1996-10-08

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

228 9, 36447705, B23K 300

Patent

active

055622437

ABSTRACT:
An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.

REFERENCES:
patent: 5036479 (1991-07-01), Prednis et al.
patent: 5060276 (1991-10-01), Morris et al.
patent: 5389764 (1995-02-01), Nishii et al.

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