(Meth)acrylate-terminated polyphenylene ether

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C528S104000, C528S112000, C528S119000

Reexamination Certificate

active

07393904

ABSTRACT:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

REFERENCES:
patent: 6352782 (2002-03-01), Yeager et al.
patent: 6835785 (2004-12-01), Ishii et al.
patent: 6894102 (2005-05-01), Merfeld
patent: 7022776 (2006-04-01), Bastiaens et al.
patent: 7247682 (2007-07-01), Amagai et al.
patent: 60-229923 (1985-11-01), None
patent: 62-041223 (1987-02-01), None
patent: 11-029621 (1999-02-01), None
Abstract, Machine Translation, JP 10120611, Katagiri et al., May 12, 1998.

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