Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2003-07-25
2004-12-28
Pezzuto, Helen L. (Department: 1713)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S391000, C528S087000, C528S421000, C568S630000, C568S631000, C568S671000
Reexamination Certificate
active
06835786
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a novel (meth)acrylate compound having a polyphenylene ether (to be sometimes referred to as “PPE” hereinafter) skeleton, a curable resin composition containing the above compound and a cured product thereof. The (meth)acrylate compound of the present invention can provide a polymer material excellent in heat resistance and dielectric characteristics by polymerizing the (meth)acrylic compound itself or copolymerizing the (meth)acrylic compound and a different unsaturated compound. Further, a photosensitive resin composition can be obtained by combining the (meth)acrylate compound of the present invention with a photopolymerization initiator. Such a photosensitive resin composition can be widely used for various applications such as a resin for a resist, a resin for a builup wiring board, a resin for sealing a liquid-crystal display panel, a resin for a color filter of a liquid crystal, a UV coating composition, various coating agents and an additive.
PRIOR ARTS OF THE INVENTION
Conventionally, (meth)acrylate compounds are widely used as a raw material for various functional polymer materials such as a photosensitive material, an optical material, a dental material, an electronic material and crosslinking agents for various polymers. However, since higher performances are required in these application fields in recent years, physical properties required as a functional polymer material become severer increasingly. As such physical properties, for example, heat resistance, weather resistance, low moisture absorptivity, high refractive index, high fracture toughness, low dielectric constant and low dielectric loss tangent are required, as disclosed in JP-A-11-214815. Until now, these required physical properties have not been completely satisfied.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a novel (meth)acrylate compound having excellent heat resistance and having a low dielectric constant and a low dielectric loss tangent, a curable resin composition containing the above compound and a cured product thereof.
The present invention provides a (meth)acrylate compound represented by the formula (1) or the formula (2),
wherein each of R
1
, R
2
, R
3
, R
4
and R
5
is independently a hydrogen atom or a methyl group, each of R
6
, R
7
and R
8
is independently a linear, branched or cyclic hydrocarbon having or less carbon atoms, —(O—X—O)— is represented by the formula (3) (in which A is a linear, branched or cyclic hydrocarbon having 20 or less carbon atoms, each of R
9
, R
10
, R
15
and R
16
is independently a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and each of R
11
, R
12
, R
13
and R
14
is independently a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group) or the formula (4) (in which each of R
17
, R
18
, R
19
R
23
and R
24
is independently a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and each of R
20
, R
21
and R
22
is independently a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group), —(Y—O)— is an arrangement of one kind of structure defined by the formula (5) or a random arrangement of at least two kinds of structures defined by the formula (5) (in which each of R
25
and R
26
is independently a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and each of R
27
and R
28
is independently a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group), Z is an organic group which has at least one carbon atom and which may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, Z is preferably an organic group which has 1 to 10 carbon atoms and which may contain an oxygen atom, each of a and b is an integer of 0 to 30, provided that at least either a or b is not 0, each of c and d is an integer of 0 or 1, and n is an integer of 0 to 10.
The present invention further provides a curable resin composition containing the above (meth)acrylate compound.
The present invention further provides a cured product obtained by curing the above curable resin composition.
REFERENCES:
patent: 6689920 (2004-02-01), Ishii et al.
patent: 2003-252833 (2003-09-01), None
patent: 2004-67817 (2004-03-01), None
Ishii et al. 2003/0194562 A1, Oct. 16, 2003.
Ishii Kenji
Miyamoto Makoto
Norisue Yasumasa
Ohno Daisuke
Mitsubishi Gas Chemical Company Inc.
Pezzuto Helen L.
Wenderoth , Lind & Ponack, L.L.P.
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