Metered gas control in a substrate processing apparatus

Details Metered gas control in a substrate processing apparatus Metered gas control in a substrate processing apparatus

1998-03-27

1999-03-09

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118719, 20429807, 20429825, 20429835, 62 62, 137 12, 4273984, 165 481, 165 61, 165 801, 165 802, 165185, C23C 1600, C23C 1400, F28F 700, F25D 2500

Patent

active

058794611

ABSTRACT:
A method of introducing gas into a substrate processing chamber. The method of introducing gas into a substrate processing chamber comprises the steps of filling a gas metering area with the gas to a first predetermined pressure, closing the area to maintain the area at the first predetermined pressure and opening the area to the substrate processing chamber. When the area is opened to the substrate processing chamber, the gas inside the area will expand into the chamber to provide the chamber with a second predetermined pressure.

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patent: 5738165 (1998-04-01), Imai

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