Metallurgical method for die attaching silicon on sapphire devic

Details Metallurgical method for die attaching silicon on sapphire devic Metallurgical method for die attaching silicon on sapphire devic

1977-04-14

1978-03-14

Kelly, Donald G.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228263, B23K 3102, B01J 1700

Patent

active

040787117

ABSTRACT:
A method for attaching a silicon-on-sapphire (SOS) device to a gold-plated surface of a package for the device. A layer of a metal adherent to both sapphire and gold such as, for example, tungsten, is deposited on the back side of a wafer of the devices. A layer of gold is then deposited on the tungsten layer. A preform of an alloy compatible with gold, such as gold-germanium, interposed between and in contact with the die and the package, is heated and then cooled to bond the die to the surface of the package.

REFERENCES:
patent: 3200490 (1965-08-01), Clymer
patent: 3298093 (1967-01-01), Cohen
patent: 3310866 (1967-03-01), Anderson
patent: 3368274 (1968-02-01), Brunet
patent: 3492719 (1970-02-01), Zeitman
patent: 3956821 (1976-05-01), Martin
patent: 3986251 (1976-10-01), Altemus

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