Metallurgical joint including a stress release layer

Details Metallurgical joint including a stress release layer Metallurgical joint including a stress release layer

1994-12-21

1995-11-28

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257762, 257764, 257772, 257751, 257779, H01L 2348, H01L 2946

Patent

active

054710928

ABSTRACT:
A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or platinum. The joint structure also includes a juxtaposed barrier layer to prevent the diffusion of a solder element, such as tin, to the stress release layer. Preferred barrier layers are chromium, titanium-tungsten and tantalum. Preferably, the joint includes one or more stress relief layer and associated barrier layer combinations in the joint structure for improved joint reliability.

REFERENCES:
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patent: 4505029 (1985-03-01), Owyang et al.
patent: 5027188 (1991-06-01), Owada et al.
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patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5136364 (1992-08-01), Byrne
patent: 5184206 (1993-02-01), Neugebauer et al.
P. L. Beaudouin and D. A. Jeannotte, Solderable Contact, Jul. 1970 IBM Technical Disclosure Bulletin vol. 13 No. 2 p. 510.

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