Metallurgical interconnect composite

Details Metallurgical interconnect composite Metallurgical interconnect composite

1997-03-04

1999-06-08

Krynski, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4283084, 428422, 428901, 174258, 174262, 174263, 439 83, 257779, 427 96, 22818021, B32B 2714, H05K 100

Patent

active

059103540

ABSTRACT:
A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.

REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 3953566 (1976-04-01), Gore
patent: 5498467 (1996-03-01), Meola
patent: 5576519 (1996-11-01), Swamy
Pending U.S. application No. 08/724,393, entitled "A Reusable, Selectively Conductive, Z-Axis, Elastomeric Composite Substrate", Meola et al., filed Oct. 1, 1996.
Pending U.S. application No. 08/752,496, entitled "Interconnected Multi-Layer Circuit Board," Suilmann et al., filed Nov. 8, 1996.

Affiliated with

Also associated with

Rating

Metallurgical interconnect composite does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallurgical interconnect composite, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallurgical interconnect composite will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1682386