Metallizing transparent conductive paths

Details Metallizing transparent conductive paths Metallizing transparent conductive paths

1986-10-15

1988-02-23

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427108, 427304, 427305, C23C 1828

Patent

active

047269650

ABSTRACT:
To metallize transparent conductive paths of indium tin oxide (ITO) on substrates of display devices, a solderable metal layer is applied by electroless deposition. If the metal layer is adjacent a liquid crystal display device, the display device may be manufactured and tested prior to the electroless deposition, with only an edge of the substrate being dipped into the deposition bath. Prior to the deposition of the solderable metal layer, the indium tin oxide surface may be reduced and an adhesion improving layer of may also be deposited by above the indium tin surface and below the solderable metal layer. Integrated circuits can then be soldered to the metallized conductive paths.

REFERENCES:
patent: 4002778 (1977-01-01), Belles
patent: 4075416 (1978-02-01), Kuttner et al.
patent: 4387116 (1983-06-01), Bucker
patent: 4478690 (1984-10-01), Scholtens
patent: 4666078 (1987-05-01), Ohno

Affiliated with

Also associated with

Rating

Metallizing transparent conductive paths does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallizing transparent conductive paths, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallizing transparent conductive paths will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-602211