Metallizing process

Details Metallizing process Metallizing process

1996-10-16

1998-06-23

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205125, 205126, 205163, 205167, C25D 534, C25D 502, C25D 554, C25D 556

Patent

active

057700320

ABSTRACT:
A process for metallizing a surface of a substrate. Preferably, the substrate is composed of a dielectric material such as a circuit board which has copper cladding on at least one face and at least one through-hole to provide a site for electrical connection to an adjacent circuit board. After cleaning the surface, it is sensitized by contacting such surface with an aqueous solution comprising a stannous salt, a precious metal salt and a source of chloride ions.

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