Metallizing paste

Details Metallizing paste Metallizing paste

1986-10-23

1989-01-24

Lieberman, Paul

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

252518, 252521, 428210, 427 96, H01B 106, H01C 700, C23C 3000

Patent

active

047999586

ABSTRACT:
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric material, such as ethyl cellulose, and a solvent, such as terpineol. The paste preferably includes frit material, such as one or more of alumina, cerium fluoride, bismuth oxide and silica. The paste may also include manganese and/or nickel.
There is also disclosed a semi-conductor package made using the metallization paste. The package includes a conductive attachment area, conductive feed-through paths, conductive vias and a conductive external underside, all of which are formed using the metallization paste in various formulations.

REFERENCES:
patent: 3323924 (1967-06-01), McRae et al.
patent: 3661595 (1972-05-01), Buck
patent: 3962143 (1976-06-01), Hitch et al.
patent: 4521250 (1985-06-01), Kuzel et al.
patent: 4540604 (1985-09-01), Siuta
patent: 4551357 (1985-11-01), Takeuchi
patent: 4733018 (1988-03-01), Prabhu et al.

Affiliated with

Also associated with

Rating

Metallizing paste does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallizing paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallizing paste will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-418115