Metallizing of plastic substrata

Details Metallizing of plastic substrata Metallizing of plastic substrata

1982-12-13

1986-05-20

Niebling, John F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Nonplanar uniform thickness material

204 30, 204 384, 427306, 427437, C25D 556

Patent

active

045901155

ABSTRACT:
Plastic substrata are metallized, preferably by direct electrolytic metallization, by (i) providing a plastic shaped article comprising intimate admixture of a polymeric resin and a plurality of small metallic filler particles of a non-conductive oxide of a non-noble metal uniformly dispersed therethrough, at least one of the face surfaces of said shaped article having exposed thereon such high density of said metallic filler particles as to provide in step (ii) metallization growth nuclei adapted for direct electrolytic metallization; (ii) next subjecting said at least one face surface of said plastic shaped article to the action of a reducing agent to essentially quantitatively convert the non-conductive metal oxide filler particles to conductive free metal, metallization growth nuclei; and (iii) thence electrochemically and/or electrolytically metallizing the at least one reduced face surface of said plastic shaped article with a free metal deposit.

REFERENCES:
patent: 2690401 (1954-09-01), Gutzeit et al.
patent: 3347724 (1957-10-01), Schneble, Jr. et al.
patent: 3775176 (1973-11-01), Cross et al.
patent: 3865699 (1975-02-01), Luch
patent: 4179341 (1979-12-01), Sakano et al.
Chemical Abstracts, vol. 76, No. 12, 63968m, p. 317, (Mar. 20, 1972).

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