Metallizing machine

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20429815, 20429823, 20429826, 20429827, 20429828, 20429829, 118719, 118728, 118729, 118730, 118503, C23C 1450, C23C 1456, C23C 1600

Patent

active

057097852

ABSTRACT:
A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a substrate to be metallized. A circumferentially-arranged rigid ring (27) of predetermined dimensions and location is disposed on the face side and mates with a ring (29) around a port (11) on the wall of the vacuum chamber which surrounds an opening in the wall. Engagement of these rings aligns the platter base (17) relative to the port (11, 12, 13 and 14). A compliant ring (42) is disposed between the wall and the platter base (17). The obverse side of the platter base (17) and the chamber are resiliently forced (37a, 37b, 37c) into contact with each other with a toggling action (24, 22b, 22) whereby to align the platter base (17) relative to the port, to force the outer diameter of the platter base (17) into metal-to-metal contact with the periphery of the port (11), to align the substrate relative to the port (11) and also to force the compliant ring into sealing engagement with the wall, thus, to form a vacuum tight seal.

REFERENCES:
patent: 4675096 (1987-06-01), Tateishi et al.
patent: 4735540 (1988-04-01), Allen et al.
patent: 4915564 (1990-04-01), Eror et al.
patent: 4943363 (1990-07-01), Zejda et al.

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