Metallizing composition

Details Metallizing composition Metallizing composition

1989-01-25

1991-04-09

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106902, 501 17, 501 19, 501 21, 524439, C23C 3000

Patent

active

050061674

ABSTRACT:
A metallizing composition is described that comprises 100 parts by weight of Au powder, from 2 to 7 parts by weight of CuO powder, from 0.3 to 2 parts by weight of a glass-based inorganic powder free from PbO, and from 3 to 8 parts by weight of a resin.

REFERENCES:
patent: 3776769 (1973-12-01), Buck
patent: 3799890 (1974-03-01), Smith
patent: 3838071 (1974-09-01), Amin et al.
patent: 3962143 (1976-06-01), Hitch
patent: 4098949 (1978-07-01), Kosiorek
patent: 4230493 (1980-10-01), Felton
patent: 4507392 (1985-03-01), Rittler
"Electrode with Improved Adhesion" Milkovich et al. 10 Mar. 66.

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