Metallized substrate

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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Details

428674, 428936, 174256, H05K 109, B32B 1520

Patent

active

056164220

ABSTRACT:
An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest. Significantly, by using an appropriate ratio of the concentration of the metal ions in solution to the concentration of the mediator ions in solution, and depending upon which mediator ions are used, the inventive bath composition serves to electrolessly deposit the metal of interest onto the substrate surface of interest, with the resulting deposited metal containing less than or equal to about 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less than or equal to about 1.0 atomic percent, of the corresponding mediator metal.

REFERENCES:
patent: 3615732 (1971-10-01), Shipley et al.
patent: 3615733 (1971-10-01), Shipley et al.
patent: 3765936 (1973-10-01), Shipley et al.
patent: 5158604 (1992-10-01), Morgan et al.

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