Metallized polymide film

Details Metallized polymide film Metallized polymide film

2008-09-09

2008-09-09

Villa, Michael La (Department: 1794)

Stock material or miscellaneous articles

Composite

Of metal

C428S220000, C428S332000, C428S626000, C428S674000

Reexamination Certificate

active

11042621

ABSTRACT:
A metallized polyimide film includes: a polyimide film including a first side and a second side; an intermediate layer that contains at least one element selected from the group consisting of Mo, Cr, Ni, Si, Fe, and Al, a deposition amount of the at least one element being between 0.3 and 15 mg/m2; and a conductive layer that is made of one of copper and a copper alloy formed on the intermediate layer; an oxygen and water barrier film that is made of at least one member selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, tin oxide, indium oxide, magnesium fluoride, magnesium oxide, aluminum, and indium tin oxide (ITO), and that has a thickness of between 5 and 300 nm formed on the second side of the polyimide film.

REFERENCES:
patent: 5130192 (1992-07-01), Takabayashi et al.
patent: 5667851 (1997-09-01), Edman et al.
patent: 6284329 (2001-09-01), Matienzo et al.
patent: 2003/0148078 (2003-08-01), Aida
patent: 05-145202 (1993-06-01), None
patent: 06-029634 (1994-02-01), None
patent: 2002-280684 (2002-09-01), None
patent: 2003-011273 (2003-01-01), None
patent: 2003-011273 (2003-01-01), None

Affiliated with

Also associated with

Rating

Metallized polymide film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized polymide film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized polymide film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3951287