Metallized polymeric substrates

Details Metallized polymeric substrates Metallized polymeric substrates

1990-05-08

1993-08-03

Shaver, Paul F.

Organic compounds -- part of the class 532-570 series

Organic compounds

Silicon containing

556413, 556438, 556439, 556440, 556414, 556404, 556405, 556452, 556454, 556457, 556458, 556459, 549215, C07F 708, C07F 710, C07F 718

Patent

active

052330672

ABSTRACT:
A method for metallizing a polymeric substrate is disclosed. The method includes contacting a surface of an etched polymeric substrate with a silane coupling agent and depositing a metallic layer over the surface. The silane coupling agent forms a chemical linkage between the substrate and the metallic layer. A coupling agent composition and a metallized polymeric substrate are also described.

REFERENCES:
patent: 2557803 (1951-06-01), Sommer
patent: 4718993 (1988-01-01), Caputa et al.
patent: 4812363 (1989-03-01), Bell et al.
patent: 4981937 (1991-01-01), Kuriyama et al.

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