Metallized polyimide film containing a hydrocarbyl tin compound

Details Metallized polyimide film containing a hydrocarbyl tin compound Metallized polyimide film containing a hydrocarbyl tin compound

1994-04-29

1996-08-06

Nakarani, D. S.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428334, 428336, 428458, 4284735, B32B 1508

Patent

active

055432220

ABSTRACT:
A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

REFERENCES:
patent: 3953658 (1976-04-01), Brandt et al.
patent: 5130192 (1992-07-01), Takabayashi et al.
patent: 5137791 (1992-08-01), Swisher
patent: 5218034 (1993-06-01), Milligan et al.
patent: 5272194 (1993-12-01), Arduengo et al.
Macromolecules, vol. 17, 1984 Easton US, pp. 1627-1632, Ezzel et al., "Surface-Semiconductive Polyimide Films Containing Tin Complexes".

Affiliated with

Also associated with

Rating

Metallized polyimide film containing a hydrocarbyl tin compound does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized polyimide film containing a hydrocarbyl tin compound, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized polyimide film containing a hydrocarbyl tin compound will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2189879