Metallized polyimide film and manufacturing method therefor

Details Metallized polyimide film and manufacturing method therefor Metallized polyimide film and manufacturing method therefor

2007-07-10

2007-07-10

Jackson, Monique R. (Department: 1773)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C428S328000, C428S330000, C428S331000, C428S458000, C428S473500, C427S532000, C427S533000, C427S535000, C427S536000, C427S537000, C427S547000, C427S551000

Reexamination Certificate

active

11044760

ABSTRACT:
A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m2.

REFERENCES:
patent: 6767644 (2004-07-01), Aida
patent: 6812164 (2004-11-01), Yamaguchi et al.
patent: 2003-011273 (2003-01-01), None

Affiliated with

Also associated with

Rating

Metallized polyimide film and manufacturing method therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized polyimide film and manufacturing method therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized polyimide film and manufacturing method therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3777595