Metallized frame which interconnects etched wirings for integrat

Details Metallized frame which interconnects etched wirings for integrat Metallized frame which interconnects etched wirings for integrat

1991-07-17

1993-06-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361421, 29847, H05K 100

Patent

active

052181723

ABSTRACT:
The invention is directed to an etched wiring (spider) for integrated circuits having a metallic frame for electrodeposition and shorting purposes proceeding all around at the periphery and connecting the wiring at several points. When separating a plurality of circuits lying side-by-side after the electrodeposition, an entire strip of the carrier material previously had to be discarded in order to enable the short-free separation of the etched wirings. In order to avoid this waste, the invention provides that the leads to the junctions of the frame with the wiring of neighboring circuits be fashioned meander-like.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3821847 (1974-07-01), Melse et al.
patent: 4631100 (1986-12-01), Pellegrino

Affiliated with

Also associated with

Rating

Metallized frame which interconnects etched wirings for integrat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized frame which interconnects etched wirings for integrat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized frame which interconnects etched wirings for integrat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1935589