Metallized device and method of fabrication

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

274 38, 427444, C23C 1500

Patent

active

039459020

ABSTRACT:
A diamond body and an oxide substrate are simultaneously sputter-etched such that the diamond body is cleaned and a layer of the sputtered oxide is deposited on the clean surface of the diamond body, then a metallic layer is deposited on the oxide layer. This provides a metallized diamond body whose metallic layer will adhere to the body.

REFERENCES:
patent: 3021271 (1962-02-01), Wehner
patent: 3325393 (1967-06-01), Darrow et al.
patent: 3634220 (1972-01-01), Goan
patent: 3661747 (1972-05-01), Byrnes, Jr.
patent: 3699034 (1972-10-01), Lins et al.
patent: 3717563 (1973-02-01), Revitz et al.
patent: 3813282 (1974-05-01), Masotti et al.
"Surface Treatment of Aluminum," by Wernick & Pinner, 3rd Edition, Draper, Ltd., Teddington, England, 1964, pp. 175, 252-253, 345-346.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metallized device and method of fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized device and method of fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized device and method of fabrication will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1642307

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.