Metallized ceramic substrate having smooth plating layer and met

Details Metallized ceramic substrate having smooth plating layer and met Metallized ceramic substrate having smooth plating layer and met

1995-07-26

1997-10-21

Thibodeau, Paul J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428548, 428552, 428565, 428569, 428663, 428665, 428672, 428680, 428704, 428901, 427 96, 427123, 4271261, 427369, 4273761, 4273763, 4273766, 4273833, 427404, 4274192, B32B 1504, B32B 1516, B32B 1800

Patent

active

056794690

ABSTRACT:
A metallized ceramic substrate having a smooth plating layer comprises a ceramic substrate containing aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate; and a nickel-based plating layer formed on the metallized layer wherein the plating layer has a thickness of not greater than 2 .mu.m and a surface roughness (Ra) of not greater than 2 .mu.m. Alternatively, the plating layer on the ceramic substrate may comprise a first nickel-based plating layer having a thickness of not greater than 2 .mu.m and a second gold-based plating layer having a thickness of not greater than 1 .mu.m wherein the gold-based plating layer has a surface roughness (Ra) of 2 .mu.m or less. These metallized substrates are produced by applying a metallizing paste containing tungsten and/or molybdenum onto a green aluminum nitride ceramic substrate, flattening the metallizing paste layer, firing the metallizing paste-coated ceramic substrate, and forming the plating layer or layers.

REFERENCES:
patent: Re34484 (1993-12-01), Nagashima
patent: 4567110 (1986-01-01), Jarvinen
patent: 5010388 (1991-04-01), Sasame et al.
patent: 5080980 (1992-01-01), Sakaguchi et al.
patent: 5132185 (1992-07-01), Iacovangelo
patent: 5134461 (1992-07-01), Yamakawa et al.
patent: 5146313 (1992-09-01), Kato et al.
patent: 5256609 (1993-10-01), Dolbert
patent: 5306891 (1994-04-01), Fleming et al.
Chem Abstracts, 6001 p. 323 Apr. 17, 1989 No. 8.
Chem Abstracts, 6001, p. 342 Mar. 1988, No. 10.
Derwent 89-293424, London, UK, (1 pg.) Dec. 1987.
Chem.Abstracts 6001,p.337 Dec. 25, 1989 No. 26.
Chem.Abstracts, 6001 p.345 Aug. 8, 1988, 109 No. 8.
Derwent Publ. JP60142547--(1 page) Jul. 1985.

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