Metallized ceramic circuit package

Details Metallized ceramic circuit package Metallized ceramic circuit package

1990-01-02

1990-10-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

174 35R, 174 51, 174 524, H05K 900

Patent

active

049673157

ABSTRACT:
The individual components of a shielded ceramic, RF mounting package are metallized on three of their outer surfaces. The package includes circuit supporting ceramic substrate metallized along its edges as well as on the horizontal surfaces to permit continuous metal contact between the substrate and a metallized ceramic seal ring and the metal lid and base of the package.

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patent: 4855808 (1989-08-01), Tower

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