Metallized ceramic and printed circuit module

Details Metallized ceramic and printed circuit module Metallized ceramic and printed circuit module

1977-01-03

1978-04-04

Abrams, Neil

Geometrical instruments

174 52FP, H05K 112

Patent

active

040823946

ABSTRACT:
A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package.

REFERENCES:
patent: 2766435 (1956-10-01), French
patent: 3333225 (1967-07-01), McNutt
IBM Tech. Disc. Bulletin, Truchi, Two-Level Printed Circuit Card, vol. 14, No. 11, Apr. 1972, p. 3482.
IBM Tech. Disc. Bulletin, Olson, Low-Noise Interconnection System for Monolithic Modules, vol. 9, No. 4, Sept. 1966, p. 360.

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