Metallized and plated laminates

Details Metallized and plated laminates Metallized and plated laminates

1984-02-22

1986-02-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156249, 156630, 156902, 204 384, 427 99, 428458, 428601, C25D 500, B32B 3100, B05D 512

Patent

active

045684138

ABSTRACT:
A carrier (10) is vapor-vacuum deposited with a vapor-vacuum deposited first metallic layer (14) of 10-90 nm in thickness. The carrier and vapor-vacuum deposited metal layers are selected of materials which, after vapor-vacuum depositing, adhere with less than about 3 pounds per linear inch of width, e.g., aluminum and copper or copper and copper. A second metallic layer (16) is electrolytically deposited to the vapor-vacuum deposited layer to increase the thickness of the first and second metal layers, taken together, to about 1-12 microns. The carrier and first and second metal layers are bonded under heat and pressure to a dielectric substrate (18). Thereafter, the carrier is peeled away leaving the vapor-vacuum deposited and electrolytically plated layers adhered to the dielectric substrate. Although the vapor-vacuum deposited layer and the electrolytically deposited layers may both be the same metal, such as copper which is preferred for circuit boards, the vapor-vacuum deposited layer may also be a relatively inactive metal, such as aluminum, chrome, zinc, or nickel, to protect the underlying electrolytically deposited metal layer from corrosion and staining.

REFERENCES:
patent: 3886022 (1975-05-01), Konicek
patent: 3936548 (1976-02-01), Konicek
patent: 4084032 (1978-04-01), Pasersky
patent: 4162932 (1979-07-01), Konicek
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4394419 (1983-07-01), Konicek
patent: 4923998 (1977-05-01), Cederberg

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