Metallization utilizing a catalyst which is removed or deactivat

Chemistry: electrical and wave energy – Processes and products

Patent

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C25D 502

Patent

active

047494492

ABSTRACT:
Metallization of nonconductive through holes with pattern plating of a conductive surface is undertaken by removing or deactivating a catalyst from undesired areas prior to electroplating onto the catalyzed surface.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky
patent: 4683036 (1987-07-01), Morrissey

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