Metallization scheme providing adhesion and barrier properties

Details Metallization scheme providing adhesion and barrier properties Metallization scheme providing adhesion and barrier properties

1989-07-28

1990-05-22

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 384, 20419225, 2041923, 357 71, 428620, 437192, H01L 2148, H01L 2128, H01L 21308, C25D 712

Patent

active

049275054

ABSTRACT:
A titanium-tungsten-nitride/titanium-tungsten/gold (TiWN/TiW/Au) packaging interconnect metallization scheme is used to provide electrical contact to chip level interconnect metallization on a semiconductor substrate. The TiWN/TiW/Au packaging interconnect metallization scheme provides for good adhesion and barrier properties that withstand high temperatures and improve the reliability of the semiconductor chip. The TiWN layer provides good adhesion to the chip level interconnect metallization and the passivation layer. It also provides improved barrier properties to prevent the diffusion of other metal atoms through it. The TiW layer provides good adhesion to the gold metal layer. A gold bump may be electroplated to the gold layer and automatically bonded to a conductive lead of a tape in TAB packaging; or a wire bonded to the gold layer in conventional packaging.

REFERENCES:
patent: 4310569 (1982-01-01), Harrington
patent: 4486946 (1984-12-01), Jopke et al.
patent: 4491860 (1985-01-01), Lim
patent: 4732865 (1988-03-01), Evans et al.
patent: 4753851 (1988-06-01), Roberts et al.
patent: 4787958 (1988-11-01), Lytle
Dening et al., IEEE/IRPS, pp. 30-36, (1984).
Meyer et al., J. Vac. Sci. Technol., A3(3), pp. 772-776, May/Jun. 1985.
Nowicki et al., Thin Solid Films, vol. 53, pp. 195-205, (1978).

Affiliated with

Also associated with

Rating

Metallization scheme providing adhesion and barrier properties does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallization scheme providing adhesion and barrier properties, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallization scheme providing adhesion and barrier properties will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2132674