Fishing – trapping – and vermin destroying
Patent
1989-09-29
1991-03-12
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437228, 437190, 437192, H01L 2148
Patent
active
049993178
ABSTRACT:
When forming a metallization layer in integrated-circuit semiconductor device fabrication, metal such as tungsten, for example, adheres poorly to a dielectric such as, e.g., silicon oxide, and tends to flake off from wafer areas not covered by a glue layer. Processing of the invention prevents such flaking by, first, removing the dielectric from the back side, edge, and "clip-mark" areas of the wafer and, second, depositing a glue layer on remaining dielectric on the face of the wafer. Removal of dielectric material is by etching in the presence of a protective layer on the face of the wafer.
REFERENCES:
patent: 4404235 (1983-09-01), Tarng et al.
patent: 4845050 (1989-07-01), Kim et al.
"Thin Film Processes", John Vossen; pp. 401-403, 408-409, 412-425, 1987.
"Thin Layers of TiN and Al as Glue Layers for Blanket Tungsten Deposition", 1987, Materials Research Society, pp. 187-195; Rana et al.
"Tungsten on Conducting Nitride Composite Film"; IBM Technical Disclosure Bulletin; Ahn et al., 8/88, pp. 477-478.
Lu Chih-Yuan
Sung Janmye
Wong Yiu M.
AT&T Bell Laboratories
Dang Trung
Hearn Brian E.
Laumann R. D.
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