Metallization process of a wafer back

Details Metallization process of a wafer back Metallization process of a wafer back

1983-06-10

1985-05-14

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427124, 427125, 4273833, B05D 512

Patent

active

045172269

ABSTRACT:
On the back of a wafer there are deposited firstly a gold layer and then an aluminium layer (eventually including a small silicon percent). It is finally carried out a thermic treatment at low temperature, which causes the aluminium migration towards the wafer through the gold layer.

REFERENCES:
patent: 3239376 (1966-03-01), Schmidt
patent: 3374112 (1968-03-01), Danon
patent: 3453724 (1969-07-01), Gilbert
patent: 3720997 (1973-03-01), Black et al.
patent: 4293587 (1981-10-01), Trueblood

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