Metallization of substrates

Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined

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427 10, 427250, B05D 312

Patent

active

049434462

ABSTRACT:
A method of metallizing a substrate by applying a metallic film to the substrate and measuring the film at a plurality of different lateral positions of the substrate by inducing an eddy current in the film and detecting the magnitude of the film to provide an indication of film thickness.

REFERENCES:
patent: 3086889 (1963-04-01), Strong
patent: 3576670 (1971-04-01), Hammond
patent: 4051270 (1977-09-01), Butler

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