Metallization of electronic insulators

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating process fluid by means other than agitation or...

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205166, C25D 556

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active

053687175

ABSTRACT:
An electroplated element is formed to include an insulating substrate, a conducting polymer polymerized in situ on the substrate, and a metal layer deposited on the conducting polymer. In one application a circuit board is formed by polymerizing pyrrole on an epoxy-fiberglass substrate in a single step process and then electrodepositing a metal over the resulting polypyrrole polymer. No chemical deposition of the metal is required prior to electroplating and the resulting layer of substrate-polymer-metal has excellent adhesion characteristics. The metal deposition is surprisingly smooth and uniform over the relatively high resistance film of polypyrrole. A continuous manufacturing process is obtained by filtering the solution between successive substrates to remove polymer formed in the solution, by maintaining the solution oxidizing potential within selected limits, and by adding a strong oxidant, such as KMnO.sub.4 at periodic intervals to maintain a low sheet resistivity in the resulting conducting polymer film.

REFERENCES:
patent: 4617228 (1986-10-01), Newman et al.
patent: 4803096 (1989-02-01), Kuhn et al.
patent: 4877646 (1989-10-01), Kuhn et al.
patent: 5106473 (1992-04-01), Whitlaw et al.
Frederick A. Lowenheim, Electroplating, Chapter 19 "Plating on Nonconductors", pp. 416-417 (McGraw-Hill Book Company 1978).
G. D. Chandler et al., "The Electrodeposition Of Metals Onto Polypyrrole Films From Aqueous Solution," 16 J. Appl. Electrochem., pp. 62-68 (1986).

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