Coating processes – Electrical product produced – Condenser or capacitor
Patent
1983-11-07
1985-01-22
Smith, John D.
Coating processes
Electrical product produced
Condenser or capacitor
427 90, 427102, 427103, H01L 2128
Patent
active
044952228
ABSTRACT:
Semiconductor devices with resistor regions, capable of operating at higher temperatures, and having improved bond pull strength are obtained by using a single layer (e.g. Ni--Cr) to act as a combined resistive layer and barrier layer. When placed in the contact windows between the semiconductor (e.g. Si) and the interconnect metallization, (e.g. Al) and Ni--Cr layer acts as a diffusion barrier to prevent interdiffusion of silicon and aluminum and contact alloying punch-through. When placed elsewhere on the device the Ni--Cr layer also serves as thin film resistor material. Wire bond pull strength is improved by placing an adhesion layer (e.g. polysilicon) beneath the portion of the resistive barrier layer underlying the bonding pads. The polysilicon layer rests on the insulator (e.g. SiO.sub.2) covering the semiconductor substrate.
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Anderson George F.
Burt Dan L.
Handy Robert M.
Motorola Inc.
Smith John D.
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