Metallization forming method

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C430S259000, C430S260000, C430S262000

Reexamination Certificate

active

07866037

ABSTRACT:
A metallization forming method comprises the steps of: patterning a silver halide emulsion on a surface of at least one side of a substrate in accordance with a desired metallization pattern to form a patterned emulsion layer; exposing the patterned emulsion layer; and thereafter developing the exposed patterned emulsion layer to form a patterned conductive silver layer having the metallization pattern.

REFERENCES:
patent: 2326058 (1943-08-01), Nadeau
patent: 2527263 (1950-10-01), Hart
patent: 2925340 (1960-02-01), Bryce et al.
patent: 3453111 (1969-07-01), Yackel
patent: 4599295 (1986-07-01), Kondo et al.
patent: 4666818 (1987-05-01), Lake et al.
patent: 5015553 (1991-05-01), Grandmont et al.
patent: 5254435 (1993-10-01), Grandmont et al.
patent: 2007/0269675 (2007-11-01), Ichiki et al.
patent: 2006-352073 (2006-12-01), None
patent: 2008-352073 (2006-12-01), None
patent: 2007-129205 (2007-05-01), None

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