Metallization for integrated circuits

Details Metallization for integrated circuits Metallization for integrated circuits

1979-12-21

1981-03-24

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29847, 427 531, 427 89, 427 96, 219121LF, 219121LM, B05D 306

Patent

active

042580781

ABSTRACT:
The sharp features that appear on metallization patterns defined by conventional etching processes can be eliminated by instantaneous melting with short laser pulses. Flow is minimized due to the brevity of the lifetime of the molten state but surface tension removes the sharp corners. With polysilicon metallization conductivity is also improved.

REFERENCES:
patent: 3838288 (1974-09-01), Stolz
patent: 3909583 (1975-09-01), Petro
patent: 4000334 (1976-12-01), Hallman
patent: 4082958 (1978-04-01), Kirkpatrick
patent: 4117177 (1978-09-01), Schlater
patent: 4159686 (1979-07-01), Heim

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