Metallization for high power handling in a surface acoustic...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S364000

Reexamination Certificate

active

06259185

ABSTRACT:

FIELD OF THE INVENTION
This invention relates in general to the field of radio frequency apparatus, in particular to radio frequency filters and more particularly to radio frequency filters employing surface acoustic wave devices.
BACKGROUND OF THE INVENTION
There is an ongoing need for component miniaturization in radio communication devices. For example, smaller and more efficient components are needed for light-weight, hand-portable cellular telephones, wireless local area networks for linking computer systems within office buildings in a readily reconfigurable fashion, pager devices and other devices for promoting rapid, efficient and flexible voice and data communication.
Filters are needed for a variety of such communications applications wherein small size, light weight and high performance are simultaneously required. Increasing numbers of products seek to employ fixed spectral resources, often to achieve tasks not previously envisioned. Examples include cellular telephones, computer and ancillary equipment linkages as well as a host of other, increasingly complex personal or equipment information sharing requirements. The desire to render increasingly complicated communications nodes portable places extreme demands on filtering technology in the context of increasingly crowded radio frequency resources.
Surface acoustic wave (SAW) ladder filters used in duplexers are a popular choice for radios because of their better performance and small size. However, a small device such as a SAW duplexer is required to handle relatively high power levels. For example, a standard specification for a SAW duplexer requires the duplexer to be able to handle 1 watt of power for a lifetime of 50,000 hours. However, existing SAW technologies have had a difficult time meeting this requirement due to the high power densities involved.
One prior art method of addressing the power handling problem included providing a three layer electrode metallization consisting of a first layer of an aluminum-copper alloy, a second layer of pure copper, and a third layer of another aluminum-copper alloy. However, this method has the drawbacks of proving is difficult to etch, being susceptible to corrosion, and requiring an additional annealing step at 400° C.
Another prior art method includes depositing a single-crystal electrode of an aluminum-titanium alloy at one time using an ion beam sputtering technique. However, ion beam sputtering is a slow process, as is known in the art, and is not suitable for mass production.
Associated prior art relating to flat panel display technology has used a layer of aluminum on a layer of titanium. This was done to control electromigration. However, this technology requires the further deposition of a dielectric film on the metal layer, a preheating step of over 300° C., and a glass substrate which is critical in defining the metallization thickness.
What is needed is a method to provide electrode metallization for a SAW device which provides good mechanical strength, stable frequency response, long lifetime at rated power, has good adhesion to a piezoelectric substrate, and is easily mass produced at a low cost.


REFERENCES:
patent: 4445066 (1984-04-01), Nishiyama et al.
patent: 4775814 (1988-10-01), Yuhara et al.
patent: 5144185 (1992-09-01), Yuhara et al.
patent: 5773917 (1998-06-01), Satoh et al.
patent: 5909156 (1999-06-01), Nishihara et al.
patent: 0 524 754 (1993-01-01), None
patent: 5-090268 (1993-04-01), None
patent: 10-093368 (1998-04-01), None
patent: 11-163661 (1999-06-01), None
Kimura et al. “High Power-Durable and Low Loss Single-Crystalline Al/Ti Electrodes for RF SAW Devices.” 1998 Ultrasonics Symposium. Jul. 1998. pp 315-318.*
“Improved Power Durability Of Surface Acoustic Wave Filters For An Antenna Duplexers”, T. Nishihara, H. Uchishiba, O. Ikata and Y. Satoh, Jpn. J. Appl. Phys, vol. 34 (May 1995), Pt. 1, No. 5B, pp. 2688-92.
“Sputtered Al-Ti Electrodes For High Power Durable Saw Devices”, J. Yamata, N. Hosaka, A. Yuhara , A. Iwama, 1998 IEEE Ultrasonics Symposium Proceedings, pp. 285-90.
“Ti-Added Al Electrodes on LiTaO3 36° Y-X Substrates For High Power Surface Acoustic Wave Devices I”, Y. Ota, N. Hosaka, A. Yuhara, J. Yamata, Jpn. J. Appl. Phys, vol. 32 (May 1993), Pt. 1, No. 5B, pp. 2351-4.
“High Power-Durable RF Band Saw Filters Using Single-Crystal Al/Ti Electodes Grown on 64° Y-X LiNbO3 Substrates”, N. Kimura, M. Nakano, K. Sata, IEE Electronic Letters Online No.:19980105, Oct. 30, 1997.
“Intermetallic Compounds Of Al and Transition Metals: Effect Of Electromigration In 1-2&mgr;M-Wide Lines”, J. Howard, J. White, J. Appl. Phys (Jul. 1978), vol. 49, No. 7, No. 5B, pg. 4083-93.
“Structure Engineering For Hillock-Free Pure Aluminum Sputter Deposition For Gate And Source Line Fabrication In Active-Matrix Liquid Crystal Displays”, A. Voutsas, Y. Hibino, J. Vac. Sci. Technol. A, vol. 16, No. 4, Jul./Aug. 1998, pg. 2668-77.

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