Metallization composite having nickel intermediate/interface

Details Metallization composite having nickel intermediate/interface Metallization composite having nickel intermediate/interface

1996-10-02

1998-02-17

Quach, T. N.

Fishing, trapping, and vermin destroying

437189, 437192, 437201, H01L 21283

Patent

active

057190704

ABSTRACT:
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.

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