Electricity: electrical systems and devices – Miscellaneous
Patent
1983-06-15
1985-04-23
Dobeck, B.
Electricity: electrical systems and devices
Miscellaneous
174 52FP, 339 17CF, 357 74, 357 80, H01L 2302, H01L 2312, H01L 3902
Patent
active
045133557
ABSTRACT:
An improved VLSI device package and an improved method for contacting VLSI devices, in which the occurrences of wire bond shorts and lead voltage drops are substantially reduced, are obtained by providing multiple lead levels in the package, with the N.sub.2 leads on the upper lead level grouped into N.sub.3 bunches separated by N.sub.4 spaces, where each of the N.sub.4 spaces aligns with a bonding target on a corresponding one of the N.sub.1 leads on the lower level leads of the package, and where N.sub.1 <N.sub.2, preferably N.sub.1 .ltoreq.20 to 30% of N.sub.1 +N.sub.2. Wire bonds from the device to the N.sub.1 lower level leads align with the bonding targets, so that wire bonds from the device to the N.sub.2 upper level leads lie in clear corridors between the bonds to the N.sub.1 lower level leads. In this way wire bond crossovers and shorts are avoided. The N.sub.1 lower level leads can be made wide and short and are used for the high current connections. Other leads can also be made wider, thus reducing inductive and resistive voltage drop in the package.
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Schroeder Jack A.
Winkler Ernel R.
Carr Roger B.
Dobeck B.
Handy Robert M.
Motorola Inc.
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